Newsletter Vol.53

| Solving Challenges in Semiconductor Grinding Production |

Based on the processing requirements of wafer materials, choose the appropriate centerless grinding or cylindrical grinding method to achieve the demand dimensions and surface finish.

JHC centerless grinding T series is suitable for workpieces with an outer diameter range of Ø6 to 230 mm. The machine is equipped with a 610mm grinding wheel allowing for substantial material removal and providing high precision and a consistent surface finish. The JHU cylindrical grinding machine can grind workpieces with a maximum diameter of 250 mm and a maximum length of 600 mm, with a load of 70 kg between two centers, offering excellent suitability for various types of wafer shapes.

Both centerless and cylindrical grinding machines can be equipped with automation, designed based on the characteristics of the workpiece. This will effectively enhance processing yield and production efficiency.

| A New Experience in Precision and Efficiency: The JHU-3510CNC Cylindrical Grinding with HMI Interface |

The JHU-3510CNC has a maximum spindle swing diameter of 350mm, a maximum grinding length of 1000mm, a maximum grinding diameter of 330mm, and a maximum load of 130kg for the two centers. The spindle table has a rotation range of 90° CCW / 30° CW, and the hydraulic tailstock design facilitates easier loading and unloading of workpieces.

This model is equipped with an HMI interface for easy operation. On the CNC homepage, operators can tap to access the main page, which includes functions for planning,processing, improvement, and common settings.

Operators can view and open established programs from the list, display current coordinates and other relevant information, control individual operations, review process parameters, quickly call up measurement or tool-setting functions, and click the edit button to modify or create new programs.

The user-friendly interface design makes operation more intuitive, simplifies the learning process for operators, and further enhances production efficiency.

Given the increasingly precise manufacturing trends in the aerospace, automotive, electronics, medical, and mold industries, the JHU cylindrical grinding machine can also be integrated with automation technology for efficient mass production. This significantly reduces manual intervention time, not only improving processing accuracy but also greatly enhancing production efficiency and capacity.

▶Visit us at IMTS Exhibition Booth 237363◀

— Exhibition —
SEMICON TAIWAN 2024

— Date of exhibition —
September 4 to 6, 2024

— Location —
Taipei, Taiwan

— Booth —
TaiNEX 1｜4th floor｜S7352

— Exhibition —
IMTS 2024

— Date of exhibition —
September 9-14, 2024

— Location —
McCormick Place, Chicago, IL

— Booth —
North Building｜Level 3｜237363

September 17th is Taiwan’s public holiday for the Mid-Autumn Festival. If you need assistance, please contact us using the quick link below. Thank you for your understanding.